Two companies have joined forces to produce SoCs with high performance and low power. MediaTek and TSMC have achieved a first together. Together, the two companies successfully developed the first 3nm mobile chipset with high power efficiency. This event also marked the turning point in the partnership between MediaTek and TSMC. This has left MediaTek’s flagship Dimensity system-on-chip behind.

Power and performance leading MediaTek’s 3nm chipsets will enter mass production in 2024!

TSMC’s 3nm process technology comes with high-performance computing support. It also provides complete platform support for mobile applications. It will also provide improved performance, power and efficiency.

Comparing the Taiwanese manufacturer TSMC’s N5 node, the results are quite exciting. It offers an 18 percent power increase at the same power level. There is also evidence of a 60 percent increase in logic density and 32 percent power efficiency performance at the same speed.

MediaTek Dimensity SoCs are designed to meet ever-increasing user experience requirements. Mobile computing, high-speed connectivity and artificial intelligence are among the biggest requirements of the technology era. The 3nm chipset produced by the two companies joining forces will surpass Dimensity SoCs with its performance.

MediaTek and TSMC’s first 3nm flagship chipset will enter mass production in 2024. And from the second half of 2024, it will power devices ranging from smartphones to smart cars.

Joe Chen, President of MediaTek: “We are committed to our vision of using the world’s most advanced technology to create cutting-edge products that meaningfully improve our lives. TSMC’s high-quality manufacturing capabilities will allow MediaTek to fully showcase its superior design in flagship chipsets. It will also enable MediaTek to deliver the highest performance and quality solutions to our global customers and enhance the user experience in the flagship market.”