Honor continues to expand its product lineup as an independent manufacturer after separating from Huawei. The Chinese brand is now focusing on the successor to last year’s X50 model, the Honor X60. Recent reports have revealed the smartphone’s key specifications and design ahead of its official unveiling.

Honor X60 Specifications Revealed

The specifications and design of the Honor X60 were leaked on the Chinese microblogging site Weibo. Unlike its predecessor, the upcoming smartphone will feature a flat-screen. It will come with a 6.8-inch FHD+ display offering a 120 Hz refresh rate and a punch-hole panel design.

The device will be powered by the MediaTek Dimensity 7025 processor. Built on a 6nm architecture, the chipset includes 2x 2.5 GHz ARM Cortex-A78 and 6x 2.0 GHz ARM Cortex-A55 cores, along with an IMG BXM-8-256 GPU.

The Honor X60 will be equipped with 12 GB of RAM, with the option to expand up to 12 GB more via virtual RAM. The smartphone will also come with 256 GB of internal storage, though other memory and storage configurations might be available as well.

For the cameras, the phone will have an 8-megapixel (f/2.0 aperture) front camera, while the rear will feature a 108-megapixel (f/1.75 aperture) primary camera. Details about additional sensors are not yet available.

Out of the box, the device will run on Android 14 with the MagicOS 8 interface. It will be powered by a 5,800 mAh battery capable of 35W charging. According to reports, the device can charge to 50% in just 30 minutes.

The release date for the Honor X60 has not yet been confirmed, but the increasing number of leaks suggests that it won’t be too long before it’s officially announced.

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