The claims that Apple will switch to a vapor chamber cooling system for the first time in the iPhone 17 Pro and iPhone 17 Pro Max models that it will introduce this year have become more concrete with new leaks. Images of the thermal components claimed to belong to the devices have been shared.
The cooling system of the iPhone 17 Pro series has been leaked
A copper thermal plate structured with micro channels is seen in the photos. This system uses the phase change mechanism to dissipate heat inside the phone. The vapor chamber system, which provides more effective heat dissipation compared to the graphite pads used in current iPhone models, has been preferred by many Android manufacturers for a long time.
Apple will include this system for the first time in the iPhone 17 Pro series. It is stated that the leaked thermal plate image shows that Apple has adopted this design in order to maintain stability in higher processing loads and gaming performance under the A19 Pro chip.
An unusual aspect of the vapor chamber is that its structure extends to the camera module. This design approach indicates that Apple plans to use both the camera housing and the outer frame of the device as passive heat sinks.
This also reveals that a hybrid strategy has been adopted in the device’s overall thermal architecture. At the same time, it is thought that this thermal design may also affect the physical appearance of the device.
There are also some changes on the agenda regarding the positioning of the camera. It is stated that Apple may switch to a horizontal camera layout, as in the Pixel series, in accordance with this new cooling system. This means a significant break in terms of design for the iPhone Pro models.
The main purpose of the new system is to prevent the device from overheating in scenarios such as games or video processing that require intensive processing. With the Apple A19 Pro chip, it aims to more effectively control the thermal load that may occur on the device, minimize performance drops and protect the user experience.
