Leaks about Honor’s highly anticipated new beast, the Magic 8 RSR, are starting to become clearer. According to reliable sources, Honor will push the boundaries with this special model, combining Porsche Design aesthetics with cutting-edge technology. Technical details shared on Weibo show that the device will not only impress with its design but also with its raw power, leaving its competitors in a sweat.
Snapdragon 8 Elite Gen 5 and 24 GB RAM
The Honor Magic 8 RSR will be equipped with Qualcomm’s latest and most powerful processor, the Snapdragon 8 Elite Gen 5. The most striking aspect is its memory capacity; with a full 24 GB of RAM and 1 TB of storage, it will offer performance akin to a portable computer. This hardware will make any task, from the most demanding games to professional video editing, child’s play.
On the front, the device will feature a 6.71-inch LTPO display with a resolution of 2808 × 1256 pixels. Honor offers the best in security:
3D Face Scanning: Secure facial recognition with a sensor at the top of the screen.
Ultrasonic Fingerprint: A 3D ultrasonic sensor hidden under the screen that works even with wet hands.
Battery life, the biggest problem of modern smartphones, is a thing of the past with the Magic 8 RSR. The massive 7200 mAh battery inside the device can easily last two days even with heavy use. Furthermore, thanks to 120W wired and wireless fast charging support, this huge battery will be charged incredibly quickly.
The Honor Magic 8 RSR is not only fast, but also very durable. The device will have IP68, IP69, and even IP69K certifications. This means the phone is resistant not only to water and dust, but also to high-pressure and hot water sprays. In terms of color, it will be offered in elegant Slate Gray and Moonstone options.
Honor is not limiting the Magic 8 series to just the RSR. Two more surprise models, the Magic 8S and Magic 8 Air, are expected to join the series. According to reports, the entire Magic 8 family will be officially introduced between mid- and late January.
