It is known that Apple has been working on A17 and A19 Pro chips for the iPhone 19 series for some time. Recent reports by Jeff Pu have revealed new information about these chips. According to the latest rumours, both chipsets will use TSMC’s third-generation 3nm lithography, called N3P.
Apple is ready to switch to N3P lithography
It all started with iPhone 15 with the A17 Bionic chip with N3B lithography. Then came the A18 and A18 Pro with N3E technology in iPhone 16. Thus, the company has improved the performance and energy efficiency of all models in the series.
Now Apple seems ready to switch to N3P lithography, which will further improve the performance of iPhones with more transistors while reducing power consumption by keeping them closer together.
This technology will be essential for the iPhone 17 Air, which at just 6 millimetres thick is probably one of the thinnest and most expensive phones ever released by Apple.
Although Jeff Pu did not provide more information, the latest leak coincides with the reports of analyst Ming-Chi Kuo, who said that Apple should not release 2nm lithography chips until 2026 with iPhone 18.
What do you think about this remarkable move of Apple?
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