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Snapdragon 8 Gen 3 and Apple A17 rival: Annoying claim for Dimensity 9300!

Ana sayfa / Processor

Competition in the mobile processor market has intensified in recent times. In the evening event to be held today at Apple, the A17 Bionic and soon-to-be-announced Snapdragon 8 Gen 3 processors will be unveiled. Additionally, MediaTek has reached the final stages of development for the Dimensity 9300. However, according to rumors, the release of this chip may encounter significant issues.

MediaTek Dimensity 9300 reportedly overheating

Evan Blass, known for his leaks in the industry, has stated that the upcoming MediaTek Dimensity 9300 processor is prone to excessive heating. It is known that the Taiwanese semiconductor manufacturer has abandoned efficiency cores in their new chip, opting instead for 4x Cortex-X4 and 4x Cortex-A720 cores, focusing solely on high-performance cores. However, the processor’s exclusive emphasis on performance seems to have led to overheating concerns, lowering expectations ahead of its launch.

The MediaTek Dimensity 9300 will use TSMC’s N4P process and is expected to be introduced at an event in October. However, as mentioned above, if a solution to the heating problem is not found, it may struggle to compete effectively against the Snapdragon 8 Gen 3 and A17 Bionic processors.

You can find the specifications of the recently unveiled MediaTek Dimensity 7200 Ultra processor below:

SpecificationDetails
Processor Architecture4nm
Processor Cores2 x Cortex-A715 @ 2.8 GHz, 6 x Cortex-A510 @ 2.0 GHz
GPUMali-G610 GPU
RAM SupportLPDDR5 and LPDDR4x
Video Recording4K 30 FPS
Camera SupportUp to 200 Megapixels
Display SupportFull HD+ (144Hz refresh rate)
HDR Support14-bit HDR image support
5G SupportYes
MediaTek APU5th generation MediaTek APU 650

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