TSMC has announced a new roadmap that will revolutionize chip manufacturing. The semiconductor giant said it will continue to push the boundaries of EUV (Extreme Ultraviolet) lithography technology to produce both smaller and more powerful chips.
How is the TSMC roadmap shaping up?
At the center of TSMC’s ambitious plans is the next-generation EUV device developed by ASML. This device, which has a numerical aperture of 0.55 compared to existing devices, will enable much more precise designs to be created on silicon wafers. This will pave the way for the production of chips with architectures of 2nm and smaller.
TSMC is not shy about investing in this technology. Aiming to complete the installation of the first EUV device at its Hsinchu R&D center by the end of 2024, the company has once again demonstrated its determination to maintain its leadership in the sector.
The technology giant confirmed that the current roadmap is the same as the one announced six months ago and that N2 and N2P technologies will enter mass production in the coming years. Then, the A16 technology is planned to be put into operation.
According to the roadmap, mass production of chips with 1.6nm architecture will start in 2026. TSMC will start producing 1.4nm chips using the new generation EUV device in 2027. With the transition to 1.6nm and 1.4nm, “Gate-All-Around” transistors using horizontal nano sheets placed vertically will also be used.
This approach will reduce current leakage and offer higher performance and energy efficiency. The A16 chip, which is expected to power the next generation of smartphones, will use another groundbreaking technology, the rear side power distribution network (BSPDN).
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