Taiwan-based semiconductor giant TSMC has already fully booked its capacity for 2-nanometer (nm) chip production, which it plans to begin next year. The company’s two production facilities dedicated to this advanced technology process have already been fully booked for 2026.
High Interest in TSMC Chips
TSMC plans to begin mass production of 2nm chips by the end of 2025 and reach its monthly production target of 100,000 wafers. This production capacity is expected to increase further starting next year.
Pilot production is currently underway at TSMC’s two factories in Hsinchu and Kaohsiung, which will focus on 2nm production. However, full-scale production has not yet begun. According to reports, the pilot-stage yield is approximately 70%.
Meanwhile, the company’s advanced packaging capacity is reportedly fully booked. This capacity could reach 150,000 units per month next year. TSMC’s largest customer for its 2nm production line has not been disclosed.
However, previous reports indicate that Apple has already secured more than half of its initial 2nm capacity, surpassing rivals Qualcomm and MediaTek.
This new lithography process, which the company calls “N2,” will be followed by an “N2P” version in the future. Each 2nm wafer will cost approximately $30,000. While this price may seem high, it is considered competitive considering TSMC’s new pricing for its 3nm technologies. The company will reportedly charge $25,000 for the N3E process and $27,000 for the N3P process.
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