The power struggle in the Android market continues, as always. The two major chipset manufacturers in the market, Qualcomm and MediaTek, aim to increase their market share and impress users by introducing new products. Now, MediaTek has unveiled its latest high-end processor, the Dimensity 9300+, an improved version of the Dimensity 9300, at the MediaTek Dimensity Developer Conference (MDDC) 2024. Here are the features of the MediaTek Dimensity 9300+:
MediaTek Dimensity 9300+ offers 10% more performance
Building on the AI advancements of its predecessor, the Dimensity 9300+, comes as an even more enhanced version, offering up to 10% performance improvement thanks to MediaTek’s new NeuroPilot Speculative Decoding Acceleration technology.
The new chipset, which boasts TSMC’s third-generation 4nm process technology, hosts eight cores: 1x 3.4 GHz ARM Cortex-X4, 3x 2.85 GHz ARM Cortex-X4, and 4x 2.0 GHz Cortex-A720. Additionally, with its 12-core Arm Immortalis-G720 graphics unit, the processor provides a smooth experience at 60 FPS.
Smartphone market reports for the first quarter of 2024 have arrived. Samsung, which managed to leave its arch-rival Apple behind, came to the top again.
To deliver more effective performance, MediaTek aims to integrate the latest HyperEngine technologies such as Adaptive Gaming Technology (MAGT), aiming to provide higher performance and longer battery life even in the most popular games.
Among the first devices to be powered by the new processor are the vivo X100s and X100s Pro, which will be unveiled on May 13th, as well as the iQOO Neo9s Pro, which will be introduced later in May.
Here are the features of MediaTek Dimensity 9300+:
| Feature | Description |
|---|---|
| Processor | 1 x ARM Cortex-X4 cores up to 3.4GHz + 3 x ARM Cortex-X4 cores up to 2.85GHz + 4 x Cortex-A720 cores up to 2.0GHz |
| Cache | 18MB L3 + SLC cache: 29% larger than the previous generation |
| GPU | Arm Immortalis-G720 MC12 GPU, 2X MSAA support |
| Artificial Intelligence | MediaTek APU 790 (Productive AI), up to 33 billion parameters, Exclusive hardware-accelerated memory compression technology, Dimensity AI LoRA Fusion 2.0 technology, Up to 10% performance increase |
| Process Technology | TSMC’s third-generation 4nm process |
| Display | WQHD at 180Hz and 4K up to 120Hz |
| Camera | Up to 320MP camera, Imagiq 990 |
| Security | HWRoT, Arm Memory Tagging Extension (MTE) Technology, CC EAL4+ Capable, FIPS 140-3, DRM |
| Communication | Sub-6GHz (FR1), mmWave (FR2), 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM |
| SIM Cards | 5G/4G Dual SIM, SA and NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR FR1 TDD+FDD, DSS, FR1 DL 4CC up to 300 MHz 4×4 MIMO, FR2 DL 4CC up to 400MHz, 256QAM FR1 UL 2CC 2×2 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 256QAM VoNR / EPS fallback |
| Location | GPS L1CA+L5+ L1C, BeiDou B1I+ B1C + B2a +B2b, Glonass L1OF, Galileo E1 + E5a +E5b, QZSS L1CA+ L5, NavIC L5 |
| Wireless Communication | Wi-Fi 7 (a/b/g/n/ac/ax/be) ready, 2T2R, Bluetooth 5.4 |
| Memory | LPDDR5T memory support up to 9600Mbps, UFS 4.0 + MCQ support |
