Google Tensor chipsets have been based on Samsung-made Exynos processors since their launch. However, with the Tensor G5 to be introduced next year, this is expected to change and Google is expected to switch to TSMC’s manufacturing process. An extensive report by Android Authority based on information from Google’s chipset division gChips details what we can expect from the Tensor G5 and G6 processors.
Major leak about the new Google Tensor series
The Tensor G5, codenamed “Laguna,” will power the new Pixel 10 series and will be manufactured on TSMC’s 3nm-class N3E process. This is the same process node as the A18 Pro processor used in Apple’s iPhone 16 Pro series and arguably the most advanced process node at the moment.
The Tensor G5 will feature an updated CPU stack consisting of 1 Arm Cortex-X4 core, 5 Cortex-A725 performance cores, and 2 Arm Cortex-A520 efficiency cores. The GPU will also be upgraded to a dual-core Imagination Technologies (IMG) DXT-48-1536 unit running at 1.1GHz.
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The new GPU unit inside the Tensor G5 will support ray tracing technology, a first for Tensor chipsets, and will offer GPU Virtualization for accelerated graphics in virtual machines. Google is also expected to offer a 14% improvement in AI tasks thanks to a new NPU.
The Tensor G6, codenamed “Malibu,” is expected to be built with TSMC’s new N3P node. While still a 3nm process, the N3P will offer significant gains in performance, power efficiency, and size. According to a leaked document, the N3P will offer a 5% increase in frequency compared to the N3E, while also consuming 7% less power and occupying 4% less surface area.
