With the official statement made by Xiaomi CEO Lei Jun, the company’s first mobile chipset called “XRING 01” was announced. While the technical specifications of the processor, which will be introduced before the end of this month, have not yet been fully disclosed, important information about the chip’s production and design process has emerged.
Xiaomi introduced its new XRING 01 mobile processor
It is stated that more than 1000 engineers took part in the development process of XRING 01. This large-scale engineering work was led by Qin Muyun, who previously held senior positions at Qualcomm. The entire project is carried out directly under Xiaomi CEO Lei Jun.
The name XRING was first brought up last month. Although detailed technical details have not been shared so far, it is known that the processor will offer an eight-core structure based on ARM’s most up-to-date core architecture.
This structure is expected to consist of one Cortex-X925 operating at 3.2GHz, three 2.6GHz Cortex-A725 and four 2.0GHz Cortex-A520 cores. It is claimed that the graphics unit will include the IMG DXT72 GPU by Imagination Technologies operating at 1.3GHz.
It is said that the new generation chipset will be produced with TSMC’s 4nm N4P production process. Choosing 4nm for XRING 01 may be a strategic decision in terms of both reducing production costs and minimizing geopolitical risks.
Xiaomi aims to reduce external dependency on hardware with its new processor. So what do you think about this? You can share your opinions with us in the comments section below.
