Sony has quietly revamped the PlayStation 5 (PS5) and new PS5 Slim models to address long-standing thermal stability and liquid metal issues. The new consoles are launching with a significant design change specifically designed to address thermal issues caused by liquid metal shifting over time.

PlayStation 5 Refresh

In the initial and early Slim versions of the consoles, the liquid metal Thermal Interface Material (TIM), used to control processor temperature, was found to shift during vertical use or frequent transport. This damaged the contact surface, causing the consoles to shut down due to thermal protection.

According to the new regulation, developed by Polish repair specialist Modyfikator, the units, codenamed CFI-2116, utilize a new liquid metal installation system featuring etched grooves around the Main Processing Unit (APU).

This grooved design creates a barrier around the APU, ensuring the liquid metal remains in place during extended use. Independent sources confirm that this design is based on the improvements Sony significantly implemented in the PS5 Pro model.

Updated information indicates that the same successful solution has now been implemented in the standard and Slim models. In addition to the PS5 and PS5 Slim units in the CFI-2100 and CFI-2200 series, the 2025 Slim CFI-2116 B01Y revision also features these etched channels around the APU.

In addition, some packages with the CFI-2116 revision feature a minor change. These new packages come with a pre-paired disc drive that does not require online activation. With these refreshed models, Sony is ensuring the long-term thermal stability of the PS5 family.