AMD is facing two separate patent infringement lawsuits in the US over the 3D V-Cache technology used in its latest Ryzen X3D series processors. Semiconductor patent licensing company Adeia claimed that AMD used its proprietary hybrid bonding technologies without obtaining a license from them. Adeia filed the lawsuit in the Federal Court for the Western District of Texas.

AMD has been in the spotlight with an interesting issue

In an official statement, Adeia stated that AMD has been using hybrid bonding in its 3D V-Cache processors since 2022. The company stated that this technology provides significant gaming performance advantages to the Ryzen X3D series. However, Adeia stated that they were unable to reach a licensing agreement with AMD during this process, and despite lengthy negotiations, no results were achieved.

The lawsuit alleges that AMD has infringed ten patents. Seven of these patents relate to hybrid bonding technologies, and three relate to advanced semiconductor manufacturing processes. Adeia argues that these patents played a direct role in AMD’s chip design process and contributed to the company’s market leadership.

The lawsuit was directed solely at AMD, despite AMD’s products being manufactured by TSMC. Adeia emphasized that TSMC is merely a manufacturer, while AMD is the designer and direct beneficiary of these technologies. This suggests that the focus of the case has shifted from production to the design phase.

Adeia stated that despite the lawsuit being filed, they are open to the possibility of a new licensing agreement, but will pursue the litigation to the fullest extent if necessary.

A potential licensing fee or substantial compensation could increase AMD’s production costs for 3D stacked processors. Given that the company plans to use this technology more broadly, particularly in Zen 6 and later architectures, this legal action has the potential to put significant pressure on AMD’s long-term roadmap. AMD has not yet issued an official response on the matter.