Testing for the DDR6 memory standard has officially begun. Next-generation DRAM development, led by Samsung, Micron, and SK Hynix, has moved beyond the prototype stage and entered intensive testing. According to information from Asian sources, DDR6 memory is planned to enter the validation phase in 2026 and be first available on server platforms by 2027.

DDR6 memory is emerging

With the new DDR6 architecture, memory speeds will start at 8,800 MT/s at the entry level. However, this figure is expected to increase to 17,600 MT/s soon. This increase is directly related to DDR6’s 4×24-bit sub-channel architecture.

Compared to DDR5’s 2×32-bit channel structure, this structure, which is more complex in terms of signal integrity, enables higher speeds. The new architecture not only significantly improves performance but also data transfer efficiency.

With increasing speeds, the physical limitations of traditional DIMM forms necessitate new solutions. DDR6 memory is currently being developed in compliance with the CAMM2 standard. Offering a thinner and more efficient form factor than traditional memory modules, CAMM2 will initially be used in server systems and will eventually be incorporated into high-performance laptops.

Due to DDR6’s high production costs, it is expected that its initial use will be limited to data centers and AI research organizations. However, by 2027, CAMM2-based DDR6 memory is expected to become widespread in both servers and high-speed desktop systems.

At a time when DDR4 is still actively used and DDR5 has yet to fully achieve widespread adoption, DDR6 represents a new leap forward in memory technology. What are your thoughts on this? Share your thoughts in the comments section below.