Intel’s Nova Lake-HX processors for high-performance laptops have been confirmed. This new series, which means a significant architectural transformation in the mobile segment, also brings with it a new socket design called BGA2540.
Intel Nova Lake-HX processors confirmed
The Nova Lake-HX series is positioned as the continuation of the Core-HX platform. It has been clarified that the processors will operate at a TDP level of 55W. The series is expected to feature a triple core architecture, namely Performance, Efficient and Low Power.
This structure points to a mobile adaptation of the 52-core design in the Nova Lake-S series. However, it has not yet been confirmed whether this core configuration will be preserved in the HX series. The new BGA2540 socket offers a pin increase of more than 20% compared to the previous FCBGA2114.
This change carries the potential for increased performance in areas such as system-wide data path width, power distribution and memory control. No change is expected in physical dimensions. This growth in the socket can provide direct benefits, especially for high-end mobile systems that require high bandwidth and energy efficiency.
Intel’s socket change schedule has also begun to become clear. The FCBGA1964 socket was used in the 14th generation Raptor Lake-HX processors. This structure evolved into FCBGA2114 with the Core Ultra 200 series. The new generation Core Ultra 300, or Nova Lake-HX, is switching to BGA2540. This transformation in the socket structure means a radical update in the hardware infrastructure of processor architectures.
It has been confirmed through shipping lists that Intel’s work on the Nova Lake architecture has begun before Computex 2025. The launch date of the processors has not yet been announced, but production preparations are about to be completed.
