MediaTek has rolled up its sleeves for a new flagship-level chipset. The company may be preparing for a big technological leap with the Dimensity 9400. According to new rumors from the industry, Dimensity 9400 will use a 150 mm2 die. This will enable the use of more transistors.
MediaTek Dimensity 9400 may come with 30 billion transistors
For comparison, even Nvidia’s graphics card uses 200 mm2 molds as standard. This means that the Dimensity 9400 could be the largest smartphone chip ever. The massive size will house more than 30 billion transistors.
Currently, the most powerful Dimensity 9300 chipset has 22.7 billion transistors. This means a 32 percent increase with the new model. The increase in transistor count will lead to significant gains in performance and device capability.
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TSMC’s 3nm process will significantly increase costs for such a large die. If the Dimensity 9400 costs MediaTek more, it could lead to higher prices for smartphones.
However, the revamped die could address the heating issues experienced by the Dimensity series’ high-performance cores. It is also rumored that MediaTek will increase the GPU by 20 percent compared to previous generations.
The GPU growth could make the Dimensity 9400 more performant than the Snapdragon 8 Gen 4, which stands out for its graphics performance. Dimensity 9400 will be launched later this year.
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