The countdown has begun for OPPO’s new flagship phones, the Find X7 series. While initial details about the devices surfaced in recent months, users have started to form some ideas about aspects like design and technical specifications. Recent reports provide significant information about the design of the high-end OPPO Find X7 Pro model.
OPPO Find X7 Pro design revealed
The leaked live images of the OPPO Find X7 Pro align with reports from the past few days. This means we see a hexagonal camera module on the rear panel of the smartphone. Additionally, this camera island is more protruding than usual, and we will soon find out if this design language poses any issues in daily use.
The device will feature a primary 50-megapixel LYT-900 camera with OIS. It is said that this sensor is a new version of the 1-inch Sony IMX989. Additionally, the model will include a 50-megapixel ultra-wide-angle camera and a pair of periscope telephoto sensors. Finally, the X7 series is expected to be released at the end of January or the beginning of February.
On the front panel of the smartphone, a curved and punch-hole display is present. It’s worth noting that the device has relatively thin bezels.
The Oppo Find X7 Pro will be powered by the Snapdragon 8 Gen 3. Qualcomm continues its collaboration with TSMC for the new processor. The processor, manufactured using 4nm technology, includes 1 3.3 GHz ARM Cortex-X4 core, 3 3.2 GHz ARM Cortex-A720 cores, 2 3.0 GHz ARM Cortex-A720 cores, and 2 2.3 GHz ARM Cortex-A520 cores. The company includes the Adreno 750 graphics unit with Ray Tracing support in its new chip.
