Samsung isn’t just positioning the Exynos 2600 chipset as the main processor for its next flagship phones. This chip also serves as the first large-scale showcase of its 2nm process, which the company hopes will help bring back its biggest customers to the foundry business. Having failed to achieve significant success with its 3nm orders, Samsung is relying on the Exynos 2600 to prove that its new node can deliver stable performance and better efficiency.
DRAM Moved to the Side, Heat Dissipated Directly
A new report from South Korea reveals that Samsung has developed a cooling method for the Exynos 2600 that has attracted the attention of giants like Apple and Qualcomm. Both companies have relied heavily on TSMC for their latest mobile and desktop chips; the main reason being the persistent thermal and stability issues experienced with Samsung’s previous flagship chipsets. Samsung claims to have addressed these concerns with a packaging method it calls “Heat Path Blocking” technology.

The Heat Path Block design utilizes a copper heatsink placed directly above the mobile AP (Application Processor). To make this arrangement possible, Samsung moved the DRAM to the side of the processor instead of stacking it on top of the chip. This placement allows the heatsink to make direct contact with the main chip, enabling heat to dissipate much faster. According to the report, internal tests show this technology delivers up to a 30% improvement in thermal performance compared to the previous Exynos generation.
Samsung missed out on much of the 3nm demand due to the early process technology failing to inspire confidence among high-end customers. The company is now more cautious with its 2nm launch but believes this node has a higher chance of competing with TSMC. Samsung expects the Exynos 2600 to act as the first real demonstration of what a 2nm manufacturing line can achieve in a consumer device.
If the Exynos 2600 delivers the thermal and performance gains Samsung is aiming for, it could help the company rebuild its confidence with major chip designers. This outcome is vital for Samsung to secure future 2nm orders and reposition itself as a competitive alternative to TSMC in advanced chip manufacturing.

