Samsung is preparing for a major comeback in the semiconductor sector. The company is establishing a competitive market position with its HBM4 memory production. Some sources suggest that Samsung could begin production 3-6 months earlier than its HBM competitor, SK hynix.

Samsung Accelerates Semiconductor Efforts

At the heart of these preparations are Samsung Chairman Lee Jae-yong’s visits to major technology companies in San Francisco and Silicon Valley over the past two weeks. Analysts see Lee’s visits as a sign that Samsung is taking personal action to overcome competitive challenges in the memory and foundry sectors and strengthen customer relationships.

The company will deliver HBM4 memory to major customers, particularly Nvidia and AMD, in the first half of 2026. After several challenging years, Samsung has finalized its next-generation technologies and is well prepared. As of August 19th, Samsung reportedly achieved the expected yield rates in its 1c DRAM development process earlier than planned and is ready for mass production.

Samsung is reportedly planning to either begin mass production at the same time as SK hynix or be one to two months ahead. The development pace has the potential to give it a three to six-month lead over its competitors. Samsung had planned to begin mass production of its next-generation 12-stack HBM4 memory, based on 10nm-class 6th generation (1c) DRAM, this year, but has postponed this to 2026.

The company has taken a more cautious path, targeting production readiness approval (PRA) in Q4 2025, and prioritizing performance and efficiency. What are your thoughts on this? Share your thoughts in the comments section below.