Competition in the mobile processor market has intensified in recent times. In the evening event to be held today at Apple, the A17 Bionic and soon-to-be-announced Snapdragon 8 Gen 3 processors will be unveiled. Additionally, MediaTek has reached the final stages of development for the Dimensity 9300. However, according to rumors, the release of this chip may encounter significant issues.
MediaTek Dimensity 9300 reportedly overheating
Evan Blass, known for his leaks in the industry, has stated that the upcoming MediaTek Dimensity 9300 processor is prone to excessive heating. It is known that the Taiwanese semiconductor manufacturer has abandoned efficiency cores in their new chip, opting instead for 4x Cortex-X4 and 4x Cortex-A720 cores, focusing solely on high-performance cores. However, the processor’s exclusive emphasis on performance seems to have led to overheating concerns, lowering expectations ahead of its launch.
The MediaTek Dimensity 9300 will use TSMC’s N4P process and is expected to be introduced at an event in October. However, as mentioned above, if a solution to the heating problem is not found, it may struggle to compete effectively against the Snapdragon 8 Gen 3 and A17 Bionic processors.
You can find the specifications of the recently unveiled MediaTek Dimensity 7200 Ultra processor below:
| Specification | Details |
|---|---|
| Processor Architecture | 4nm |
| Processor Cores | 2 x Cortex-A715 @ 2.8 GHz, 6 x Cortex-A510 @ 2.0 GHz |
| GPU | Mali-G610 GPU |
| RAM Support | LPDDR5 and LPDDR4x |
| Video Recording | 4K 30 FPS |
| Camera Support | Up to 200 Megapixels |
| Display Support | Full HD+ (144Hz refresh rate) |
| HDR Support | 14-bit HDR image support |
| 5G Support | Yes |
| MediaTek APU | 5th generation MediaTek APU 650 |
