TSMC is planning a revolutionary change in chip production by abandoning traditional round wafers and transitioning to innovative rectangular substrates. These new substrates will allow for more chips to be placed on each unit, exponentially increasing production. What are the benefits of this change? Here are the details…
TSMC to use rectangular substrates for future AI technologies
The rectangular substrates that TSMC is working on measure 510 mm x 515 mm, offering three times more usable space than standard round wafers. This shape minimizes waste by optimizing the use of space, reducing the gaps at the edges. Although this technology is still experimental, it may take several years before it is commercially available.
The increasing interest in artificial intelligence (AI) technologies necessitates chip manufacturers like TSMC to keep up with the demand for computational power. Chip packaging plays a critical role in the advancement of semiconductor technology. TSMC’s CoWoS (chip-on-wafer-on-substrate) technology will enhance data processing speed and computational performance, as seen in Nvidia’s H200 and B200 AI processing chips, with advanced packaging methods.
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Transitioning to rectangular substrates will pose significant challenges for TSMC and its suppliers. Time and resource investments will be needed to develop and adapt production processes. Additionally, understanding how photoresist application methods will work on the new substrates will be a major challenge. So, what are the benefits of this technology for us?
This new technology will lead to less material waste during the production process and significantly reduce overall production costs. These cost savings will be passed on to consumers as more affordable products. Rectangular substrates allow for more chips to be placed in the same area, resulting in higher processing power and performance. This means faster and more efficient smartphones, computers, and other electronic devices for consumers.
TSMC’s main competitor, Samsung, is also conducting intensive R&D on glass substrates for chip production. Glass substrates offer higher flatness compared to organic substrates, increasing the precision of lithography processes. Samsung plans to introduce this technology in 2026.
The development of these new technologies promises significant advancements in the semiconductor industry. What do you think? Share your thoughts in the comments below.
