TSMC’s First US Factory Set to Begin Mass Production for Apple in Early 2025
TSMC’s first factory in the United States, located in Arizona, is now ready and expected to start mass production of chips for Apple in early 2025. This information comes from a report published today by Nikkei Asia, which confirmed that the facility is prepared and projected to commence operations in the first quarter of the year. Here are the details:
A Major Move by TSMC for Apple
The Arizona factory, a result of an $11.6 billion investment from the United States and a $5 billion loan for semiconductor production in Phoenix, aims to nationalize chip manufacturing to ensure America’s sovereignty, security, and independence in the face of competition from China.
Apple is currently in the final stages of validating the first batch of “US-made” state-of-the-art processor chips produced at Taiwan Semiconductor Manufacturing Co.’s Arizona facility. Sources familiar with the matter have revealed that the first commercially mass-produced chips are expected as early as this quarter once quality assurance processes are completed.
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Initially, the factory will produce A-series chips for older Apple devices. However, TSMC has already secured permission from the Taiwanese government and is expected to begin 2nm chip production in 2028. The factory’s opening, however, has sparked controversy due to TSMC’s decision to bring a large workforce from Taiwan to the US facility instead of hiring locally.
Advantages for Apple and the US Market
TSMC’s Arizona factory is set to enable local production of advanced chips used in iPhones and other Apple devices. This move will:
- Enhance the security of Apple’s supply chain.
- Minimize potential delays in chip supplies.
- Accelerate production processes.
Additionally, Apple will have the opportunity to label its products as “Made in the USA,” further boosting its brand image. This initiative is expected to lead to the development of more powerful chips with improved performance, energy efficiency, and innovative features.
