There is serious competition in the foldable phone market . Brands are launching new models day by day in order to get a little more share of the cake. Xiaomi, one of the manufacturers operating in this field, will soon offer the Mix Flip model to users. Finally, the design of the device has been revealed. Here is the Xiaomi Mix Flip design!
Xiaomi Mix Flip design has been announced
According to the latest reports shared by GSMChina , Xiaomi Mix Flip will appear before the user with a perforated screen design. However, there will be a horizontally positioned dual camera setup on the back panel of the foldable phone. Moreover, in this module we will be greeted by a 50 Megapixel main and a telephoto sensor of unknown resolution.
The processor that will power the smartphone will be Qualcomm Snapdragon 8 Gen 3. The processor, produced with 4 nm technology, has 1 3.3 GHz ARM Cortex-X4, 3 3.2 GHz ARM Cortex-A720, 2 3.0 GHz ARM Cortex-A720, and 2 2.3 GHz ARM Cortex-A520 cores. Moreover, the company includes an Adreno 750 graphics unit with Ray Tracing support in its chip.
The model is expected to include useful features such as satellite connection. Apart from this, it is among the information that the foldable phone will be introduced in May.
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