Xiaomi has taken a new step toward a more independent structure in mobile processor and connectivity technologies. Having recently introduced the XRING 01 chipset, the company announced its first chip with its own processor architecture, and now aims to reduce external dependency in this area by developing its own 5G modem. This modem will be integrated into the next-generation chipset, known as the XRING 02.
Xiaomi to develop its own 5G modem
Xiaomi, which used a 5G modem manufactured by MediaTek in the XRING 01, encountered limitations in efficiency and system optimization due to this outsourced component. This led to the first-generation chip being used only in select devices. With the XRING 02, the company plans to combine the modem and processor on a single platform, gaining full control over hardware and software.
The new chipset won’t be limited to smartphones. The XRING 02 is also expected to be used in the automotive sector. Xiaomi plans to incorporate this new chip in its electric car projects, providing integrated solutions in terms of both performance and data connectivity. This strategy is considered a significant turning point for the company integrating processing power and connectivity technologies.
Xiaomi’s 5G modem development is proceeding within the framework of US technology embargoes. While the company lacks direct access to advanced foundry technologies, it is working to address this gap through China-based collaborations.
It is highly likely that TSMC’s 2-nanometer process will be used in the production of the XRING 02 chipset. This could enable Xiaomi to produce a more competitive chip in terms of performance and energy efficiency.
While there is no definitive date for the completion of the XRING 02 and its integrated 5G modem development, the company’s plan to further leverage its technologies in the mobile and automotive markets is clear.
