Technology company Intel has come to the fore with a remarkable success. The company has launched glass substrates for next-generation advanced packaging, planned for the second half. However, it has become a matter of curiosity what the use of glass is for in new generation processors. Here are the details!
Intel introduced the new generation glass layer!
Intel , which is constantly on the agenda with the problems in the semiconductor industry , this time appears with an interesting success. The company recently introduced the first glass sheet for next-generation packaging that will advance Moore’s Law.
Intel’s Vice President Babak Sabi made a statement about this innovation. In his statement, he stated that more than ten years of research have been carried out for the glass layer. After these innovations, the glass layer became a matter of curiosity.
Compared to other organic substrates, glass carries higher interconnect density. In addition, it also has better physical, optical and thermal properties . In addition, compared to other layers, glass can withstand working conditions at higher temperatures.
With all this, the glass layer provides 50 percent less pattern distortion. Normally, the edges of the modern chip have a glass-like structure and consist of organic materials. Thanks to the new generation glass surfaces, Intel not only makes the chips thinner but also increases the interconnect density .
In addition, the improved properties of glass also enable form factor packages with particularly high assembly efficiencies. The company aims to deliver one trillion tensistors in one package by 2030 . In addition, this development comes after the company’s $3.5 billion investment in its New Mexico production facility.
