The first information about AMD’s Zen 7 architecture has come to light. In the new generation processors, the traditional V-Cache design used by the company in its previous models will be abandoned. Instead, a much more advanced 3D core architecture is coming.

AMD is here with Zen 7 processors

According to the leaked information, three different types of cores will be used in Zen 7 processors. These cores include high-performance main cores, “dense” cores optimized for high-intensity workloads, and efficiency-focused cores operating with low power consumption. This hybrid structure will enable dynamic resource management according to different workloads.

The CCD chips in the new generation processors will be produced with the A14 technology, the most advanced production process in the 2nm class developed by TSMC. This production method supports modern silicon design techniques such as backside power delivery.

On the other hand; SRAM chips that come with the 3D core architecture will be produced with the current N4 process, unlike classic V-Cache systems, and will be integrated into the lower layer of the cores. Although the final configurations have not yet been determined, it has been reported that this architecture can offer significant gains in terms of gaming performance.

The use of 3D cores in particular can enable significant performance increases in games that require intensive graphics processing power. The launch of the new Zen 7 processors is indicated as 2028. Before this date, AMD will continue to operate in the market with the Zen 6 series processors.