Honor, which continues its activities in the foldable phone market, is set to introduce the Magic V4 very soon. While not much information has surfaced about the device until now, this is beginning to change. The latest developments reveal the smartphone’s processor.

Which processor will power the Honor Magic V4?

According to reliable industry sources, the Honor Magic V4 will be equipped with the Qualcomm Snapdragon 8 Elite chipset. Manufactured using the 3nm process, this hardware features 2x 4.32 GHz and 6x 3.53 GHz cores, along with the Adreno 830 GPU.

Before OPPO launched the Find N5, the title of the world’s thinnest foldable phone belonged to the Honor Magic V3. Sources suggest that the upcoming Honor device will once again stand out with its slim design and may even reclaim this title from the Find N5.

Renowned industry leaker Digital Chat Station has shared the expected launch date for the Magic V4. The device is expected to offer up to 16 GB of RAM and up to 1 TB of internal storage. Additionally, it will run Android 15 right out of the box.

For reference, here are the specifications of the Magic V3:

Feature	HONOR Magic V3
Inner Display	7.92-inch FHD+ OLED, 2344 x 2156 pixels, 120Hz, HDR10+, max 5000 nits brightness
Outer Display	6.43-inch FHD+ OLED, 2376 x 1060 pixels, 120Hz, HDR10+, max 5000 nits brightness
Aspect Ratio	Inner: 9.78:9, Outer: 20:9
Stylus Support	Yes
Dimensions	156.6 x 145.3 mm (folded: 74.0 mm) × 4.35 / 4.4 mm (folded: 9.2 / 9.3 mm)
Processor	Snapdragon 8 Gen 3, Adreno 750
RAM	12 GB / 16 GB LPDDR5X
Storage	256 GB / 512 GB / 1 TB UFS 4.0
Rear Cameras	50 MP Main (f/1.6), 50 MP Periscope (f/3.0), 40 MP Ultra-Wide (f/2.2)
Front Camera	20 MP (f/2.2)
Battery	5150 mAh, 66W Wired Fast Charging, 50W Wireless Fast Charging
Durability	IPX8 dust and water resistance
Operating System	MagicOS 8.0.1 (Android 14)

So, what do you think about this? Do you believe this smartphone will meet expectations? Don’t forget to share your thoughts in the comments!