Honor continues to expand its smartphone lineup with new models. The Chinese company is preparing to launch its new foldable clamshell phone, the Magic V2 Flip, in the near future. Previously leaked technical details have now been confirmed as the device successfully passed important certification processes.
Honor Magic V2 Flip receives CMIIT and 3C certification
Expected to be unveiled in China this August, the Honor Magic V2 Flip appeared in the CMIIT and 3C certification records under the code CLE-AN00. These documents reveal that the phone will have a 5,370 mAh battery. While the 3C certification mentions 80W wired fast charging support, the actual charging speed is expected to be around 66W.
The phone’s inner display will be 6.8 inches, featuring an FHD+ resolution and LTPO OLED technology. The outer cover will have a 4-inch screen. On the processor side, it is expected to use a Snapdragon 8 series chip, but likely not the Snapdragon 8 Elite—probably the Snapdragon 8s Gen 4 or another variant.
The camera setup is also noteworthy, with a 50-megapixel main sensor sized at 1/1.5 inches and equipped with optical image stabilization. The Magic V2 Flip will compete in a similar segment as rival models like the Xiaomi Mix Flip 2 and the Galaxy Z Flip 7.
What do you think about Honor’s new foldable phone? Feel free to share your thoughts in the comments.
