Intel continues to expand its product family by incorporating the latest technologies, as showcased at their third annual Intel Innovation Event. In a time where artificial intelligence (AI), silicon, and software converge to form a new global expansion age termed as ‘Siliconomics,’ Intel’s recent offerings reveal an ambitious path toward integrating AI across client devices, networks, and clouds.
Pushing Boundaries with AI
Intel CEO Pat Gelsinger highlighted AI as a “generational shift” that paves the way for a new global expansion age, where computing lays the foundation for a better future for everyone. This, he explained, opens up immense societal and commercial opportunities to address the world’s greatest challenges.
The Silicon Innovation
At the core of Intel’s advancements is silicon innovation. With a five-noded process development program, Intel is on schedule. Intel 7 is already in high-volume production, Intel 4 is ready for production, and Intel 3 will launch by the end of the year. A test chip for the Arrow Lake processor, due to enter the client computer market in 2024, was also displayed.
Packaging Technologies
Intel is also innovating in packaging technologies, including the use of glass substrates, which could extend Moore’s Law beyond 2030. Another notable technology is the Universal Chiplet Interconnect Express (UCIe), which is supported by more than 120 companies and allows chiplets from different vendors to work together.
Increasing Performance and Pervasive AI
Recent MLPerf AI inference performance results reinforce Intel’s commitment to handle all stages of AI continuity, making Intel Gaudi2 a viable alternative for AI computing needs. Gelsinger announced the construction of a massive AI supercomputer powered entirely by Intel Xeon processors and 4,000 Intel Gaudi2 AI hardware accelerators, with Stability AI as the main customer.
The Next Generation of Intel Xeon Processors
Intel previewed its next-generation Intel Xeon processors, revealing performance improvements and faster memory combinations. Two particularly interesting models, Sierra Forest and Granite Rapids, will offer significant performance boosts, especially in the domain of AI.
Intel Core Ultra AI-Powered Computers
Gelsinger also introduced Intel Core Ultra processors, marking a milestone in client CPU roadmaps. These will include Intel’s first integrated Neural Processing Unit (NPU) and will be supported by advanced 3D packaging technology, Foveros.
Empowering Developers in the Age of Siliconomics
In sum, Intel is handing the control of ‘Siliconomics’ to developers, empowering them with a versatile set of AI technologies and silicon innovations. As AI becomes an integral part of computing, from data centers to personal computers, Intel is positioning itself as a key player in this new era.
Intel’s relentless focus on integrating AI, advancing silicon technology, and pushing the boundaries of what’s possible paints a promising picture for the future of technology and its societal impact. As AI continues to revolutionize computing, Intel aims to be at the forefront, turning challenges into opportunities for global improvement.
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