Intel has not responded significantly to the performance advantage provided by AMD’s X3D series in the desktop processor market for a long time. However, recent developments show that the company will break its silence in this area with the Nova Lake series.

Intel is here with the Nova Lake series

Intel’s new processors are expected to use a structure similar to the 3D cache architecture. This move was considered a critical step especially for areas such as high-performance gaming and workstations.

At the Intel Direct Connect 2025 event held recently, the company introduced the 18A-PT production process, which is a milestone in terms of 3D chip technologies. 18A-PT stands out as a variant of the standard 18A process optimized for multi-layer chip designs.

This new production process works integrated with Intel’s hybrid packaging technology called Foveros Direct. Foveros Direct will be one of the densest chip connection solutions in the industry by reaching sub-5 micron connection range.

In comparison, TSMC’s SoIC-X architecture remains at 9 microns in this connection range. This difference allows Intel to develop more compact and high-bandwidth chip solutions.

The company is expected to use this architecture first in the server segment. Intel’s upcoming Clearwater Forest series Xeon processors will also test the field performance of Foveros Direct technology. The results will determine whether the technology will be integrated into desktop processors.

So what do you think about this technology? You can share your thoughts with us in the comments section below.