Intel, a giant in the semiconductor world, is taking its manufacturing technologies to the next level. The company showcased its next-generation packaging capabilities developed for future high-performance computers and artificial intelligence systems. Seeking to strengthen its position against competitors like TSMC, the technology giant combined its 18A and 14A manufacturing processes with Foveros 3D and EMIB-T technologies to introduce a new architecture offering massive scalability. This new design promises a structure that can exceed current limits by up to 12 times.
Massive Scalability and High Performance Combined
The conceptual designs shared by Intel reveal the new limits achievable in chip architecture. The most powerful configuration introduced by the company houses 16 processor tiles and a full 24 HBM (High Bandwidth Memory) slots on a single package. This structure spans an area larger than 12 reticles, creating immense processing power. Advanced interconnection technologies play a critical role in enabling such complex and large structures to work together.
At the heart of the new architecture is a base layer manufactured using the Intel 18A-PT process. This layer, just like in Clearwater Forest processors, houses the SRAM memory and power management units. Above this, high-performance processor and AI cores manufactured with Intel 14A or 14A-E technology are placed. These two different layers are interlocked with micron-level precision connections thanks to Foveros 3D packaging technology. This allows for the most efficient positioning of logic circuits and memory units.
With this display of strength, Intel is targeting not only its own products but also external customers who will use its foundry services. In particular, thanks to EMIB-T technology, the data bus between chips is expanded, ensuring full compliance with HBM4 and future HBM5 memory standards. These massive packages, capable of housing up to 48 LPDDR5x controllers, more than meet the bandwidth requirements for AI and data center workloads. Aiming to leave behind the efficiency problems experienced in the Ponte Vecchio project, the company aims to be the strongest alternative for third-party customers with its 14A technology.
Do you think Intel can reclaim the lead from TSMC with this massive chip packaging technology? Share your thoughts with us in the comments!
