Qualcomm has announced two new audio chips for wireless headphones, S3 Gen 3 and S5 Gen 3. These new audio chips aim to improve the sound quality of more affordable wireless headphones and combine advanced connectivity features and AI-powered audio technologies.
With Qualcomm’s new chips, even cheap wireless headphones will have high sound quality
Qualcomm’s S3 Gen 3 and S5 Gen 3 chips support Bluetooth 5.4 LE and Auracast for stronger and more stable wireless connectivity. Users will experience better sound quality and less interruption when listening to music. In addition, the new chips feature advanced Active Noise Cancellation (ANC) to more effectively block out ambient noises for a quieter listening experience.
S3 Gen 3 is a chip designed for mid-range headphones. It supports key audio technologies such as ANC, aptX Adaptive, aptX Lossless, and aptX Lossless, offering users a high-quality audio experience. It also provides clearer sound thanks to the improved Digital-to-Analog Converter (DAC).
On the other hand, S5 Gen 3 stands out as a chip designed for higher-end headphones. The S5 Gen 3 has more memory and DSP processing power, resulting in improved sound quality and performance. It also supports cutting-edge connectivity features such as Bluetooth 5.4 LE Audio, Bluetooth Auracast and Spatial Audio.
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These new audio chips offer wireless headphone makers a wider range of options and provide users with a better music experience, longer battery life and improved audio performance. Qualcomm’s S3 Gen 3 and S5 Gen 3 chips aim to usher in a new era in wireless audio technology.
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