Apple M series processors are getting stronger! Here are the Apple M4 family features

Apple, which released the M3, M3 Pro, and M3 Max processors last October, has completed its work on the new models of the M series. The technical specifications of the Apple M4 series, which is expected to be unveiled in October this year, have been leaked. Here are the details…

Specifications of the Apple M4 series leaked

According to the leaked information, Apple will introduce 5 different variants of the M4 this year. The Apple M4 will be for entry-level models, M4 Pro and M4 Max for mid-to-high-end models, and M4 Ultra and M4 Extreme for flagship models.

Famous analyst Mark Gurman announced that the M4 chip Mac series is planned to be released in late 2024 and early 2025. The iMac, 14-inch MacBook Pro, 16-inch MacBook Pro, and Mac mini will initially be updated with M4 chips.

MacBook Air models will be released in the second quarter of 2025, Mac Studio in mid-2025, and Mac Pro at the end of 2025. It is said that Apple is nearing production of the M4 processor, which is expected to come in at least three main varieties.

Chips codenamed Donan for entry-level, Brava for mid-range, and Hidra for flagship will attract attention with their artificial intelligence performance. The Donan chip will be used in entry-level MacBook Pro, “MacBook Air” machines, and lower-level “Mac mini,” while the Brava chips will be used in higher-level MacBook Pro and higher-level “Mac mini.”

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Information leaks suggest that the Hidra chip is designed for the “Mac Pro” and will come in two variants: “Ultra” or “Extreme.” As for the “Mac Studio,” Apple will likely have versions with an unreleased M3 era chip and probably higher-level than the M4 Pro and M4 Max “Brava” chips.

M4 versions of Mac desktop computers may support up to 512 GB of Unified Memory; this is considered a significant leap beyond the current 192 GB limit. M4 chips will be built on the same 3-nanometer process as M3 chips, but Apple supplier TSMC will likely use an improved version of the 3nm process to enhance performance and power efficiency.