The tech giant is bringing new technologies to its devices to offer better quality and performance. For a long time, Google has been working on its upcoming G-series chipset, the Tensor G3. Now, more leaks about the expected chipset have been revealed. According to the latest reports, Google Tensor G3 won’t have any heating issues thanks to Samsung’s enhanced technology. Here are the details about the Google Pixel 8 and Tensor G3…
Tensor G3 will feature Fan-out Wafer-level Packaging technology
Depending on the earlier rumors, we know that Google has made a cooperation with Samsung to develop the Tensor G3 for Pixel 8 series. If the rumors are true, the G3 chipset will be among the first Samsung-made smartphone chips to feature Fan-out Wafer-level Packaging or FO-WLP technology. Thanks to this technology, Google Pixel 8 will be the coolest smartphone in the Pixel series.
In fact, other chip manufacturers have been using this technology since 2016, but Samsung is using it for the first time. A reliable tipster says, “The Tensor G3 is the first among Samsung Foundry’s smartphone chips to incorporate FO-WLP packaging, which is expected to reduce heat generation and increase power efficiency for the Tensor G3.”
Now, let’s take a look at the specifications of the G3. According to the leaks, the 4nm Tensor G3 will be available in Pixel 8 and Pixel 8 Pro, and it will have a 9-core CPU – one Cortex-X3 prime core, four Cortex-A715s, and four Cortex-A510s. Also, it will have a 10-core Arm Immortalis G715 GPU.
Although there are no more details about the upcoming devices, we know that Google will officially hold its upcoming “Made by Google” event on October 4. At the event, the company is expected to announce the new Pixel smartphones, smartwatches, and more.
What do you think about the upcoming products? Don’t forget to share your opinions below.
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