Taiwan-based semiconductor manufacturer TSMC has unveiled its next-generation 1.4 nm manufacturing process. The technology, called “A14,” is planned to enter mass production in 2028. This system will also bring with it a new optimization technology called NanoFlex Pro.

TSMC unveils its 1.4 nm manufacturing process

According to TSMC’s statement, the A14 manufacturing process offers significant advantages over the current 2 nm technology. The company stated that a 10% to 15% performance increase was achieved under the same power and circuit complexity.

It was also announced that the A14 consumes 25% to 30% less power and offers a 20% higher transistor density when compared to the same frequency and transistor density. In this way, processors will become more compact, more efficient, and more performing.

Preferring the traditional front surface power distribution structure, the A14 provides lower production costs, especially for applications that do not require intensive power cabling. The company plans to bring the Backside Power Delivery Network system to the second generation of the A14.

The NanoFlex Pro architecture that comes with the A14 offers chip designers more flexibility. This system allows manufacturers to fine-tune transistor configurations for specific applications or workloads. This makes it possible to produce custom designs according to each customer’s needs.

According to TSMC’s current roadmap, N2P and A16 production processes, which are advanced versions of 2nm technology, will enter mass production towards the end of 2026 before the A14. What do you think about this? You can share your thoughts with us in the comments section below.