TSMC, one of the world’s largest semiconductor manufacturers, is preparing to surpass a significant threshold in 2nm chip production. According to the information provided, the company has reached a 60 percent efficiency rate in the trial production process. It is said that it can increase the production of 50 thousand wafers per month by the end of the year. If everything goes well, this figure could reach 80 thousand wafers by the end of 2025. So how will TSMC reach this goal? Here are the details…

TSMC is progressing at full speed in 2nm production

Taiwan-based semiconductor giant TSMC is focused on increasing its capacity in the production of new generation 2nm chips. The company currently has two main facilities: Baoshan and Kaohsiung. In the first trial productions, both facilities started the process with a production target of 5 thousand wafers. However, according to recent developments, production efficiency is increasing and the company is preparing to switch to full capacity in these facilities.

According to the company’s plan, when the Baoshan facility reaches full capacity, it will be able to produce 25 thousand wafers per month. The same applies to the Kaohsiung facility, which will bring total production to 50,000 wafers. However, if there are no disruptions in the production process, this figure is expected to increase to 80,000 wafers by the end of 2025.

These developments are seen as a major strategic step considering the high demand for 2nm chips. 2nm technology, which is in higher demand than 3nm chips, will play a critical role in many areas from mobile devices to artificial intelligence systems.

On the other hand, Samsung, one of TSMC’s biggest competitors, is reported to be at a 30 percent efficiency level in 2nm production. This shows that TSMC maintains its competitive advantage.

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