Resonac Corporation, together with ten leading companies from the US and Japan, has formed a new consortium to revolutionize semiconductor technologies. Called “US-JOINT”, the initiative will work on advanced semiconductor packaging technologies in Silicon Valley.
US-JOINT consortium and the US and Japan joining forces
The US-JOINT consortium, announced by Resonac Corporation, brings together ten major semiconductor materials and equipment companies from the US and Japan. These companies include Azimuth, KLA, Kulicke & Soffa, Moses Lake Industries, MEC, ULVAC, NAMICS, TOK, TOWA and Resonac. The new R&D center will be located in Union City, California and is expected to be fully operational in 2025.
The new center will conduct research and development on advanced packaging technologies to meet the needs of semiconductor device manufacturers in real time. The consortium is also designed to validate the latest requirements and develop new concepts in collaboration with customers.
New approaches for advanced packaging technologies
“Today’s rapidly developing next-generation semiconductors require new packaging technologies, especially for artificial intelligence and autonomous driving,” said Hidenori Abe, Executive Director of Resonac Electronics Business Unit. Abe emphasized that the US-JOINT consortium will make a major contribution in this area, and noted that major semiconductor manufacturers in Silicon Valley are focusing on innovative packaging technologies.
While advanced packaging and back-end processing of semiconductors has traditionally been done in Asia, this new initiative aims to further develop these technologies in the US. This will bring them closer to semiconductor device manufacturers and help them resolve technical issues faster.
How big is the cooperation?
“Given the growing importance of semiconductors in every aspect of our lives, it is critical to strengthen supply chains by collaborating with trusted partners,” said Rahm Emanuel, US Ambassador to Japan. Emanuel said the US-JOINT consortium is a good example of the two countries’ cooperation in developing advanced technology.
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The US-JOINT consortium opens the doors to a new era in semiconductor technologies by bringing together leading companies from the US and Japan. This collaboration has the potential to shape the technologies of the future and will set the stage for significant developments in the semiconductor industry.
