TSMC, the largest semiconductor manufacturer in the industry, is moving to full capacity in its 2nm production process. Total monthly production capacity at four different facilities located in Kaohsiung and Hsinchu, Taiwan, is expected to reach 60,000 wafers. The company will fully enter this new era by 2025.

TSMC to accelerate 2nm production

TSMC’s P1 facility in Kaohsiung has begun mass production of 2nm chips and currently produces approximately 10,000 wafers per month. Equipment installation is underway at the P2 facility. This facility is also planned to begin trial production within a few months and reach full capacity, producing 30,000 wafers per month.

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The P1 facility in the Hsinchu region has completed the trial production phase. The countdown to mass production has begun. The P2 facility is currently under construction. The total production capacity of the four factories in both regions is planned to reach 60,000 wafers by the end of the year. This capacity increase positions TSMC as an industry leader in 2nm technology and demonstrates its pricing stance at a time when competition is weakening.

Despite its increased production capacity, TSMC will not reduce prices. The unit price of the 2nm chips offered to customers will be 50 percent higher than the current 3nm process. Each wafer is expected to cost approximately $30,000. This could directly impact the 2nm transition plans of major customers such as Apple, Qualcomm, and MediaTek, which are expected to occur in 2026.

Competitive dynamics play a significant role in maintaining high prices. Samsung’s entry into the market with its 2nm GAA architecture Exynos 2600 chip is among the potential developments that could increase pricing pressure. If Samsung improves its production efficiency, TSMC may need to reassess its current pricing policy.